(footprint "SMDPAD_75MIL" (version 20221018) (generator pcbnew)
  (layer "F.Cu")
  (fp_text reference "REF**" (at 0 0) (layer "F.SilkS")
      (effects (font (size 1.27 1.27) (thickness 0.15)))
    (tstamp 9e88e2c1-16a8-42fe-aff2-7529adb2719f)
  )
  (fp_text value "" (at 0 0) (layer "F.Fab")
      (effects (font (size 1.27 1.27) (thickness 0.15)))
    (tstamp 49700ad9-0e65-41f3-b506-a69eb8551907)
  )
  (pad "PAD" smd roundrect (at 0 0) (size 1.905 1.905) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
    (solder_mask_margin 0.0508) (thermal_bridge_angle 0) (tstamp a8c59a0a-efe5-41d1-aeed-b0f9dc41019e))
)
